SYSTEM
Chipsets:SMSC FDC37C669 Super I/O,Intel® 82599 Fast Ethernet Controller,Ti PCI1410 Cardbus controller
Expansion Slots:PC/104
Form Factor:3.5" baseboard (For ETX CPU Modules)
Battery:Lithium Battery for real time clock
Compact Flash:CF Card connector, support Type I
PCB Layer:4 Layers
Dimensions:101mm x 146mm
Operating Temperature:0°C ~ 60°C
Storage Temperature:-20°C ~ 80°C
Relative Humidity:10%~90%，无凝露
DISPLAY
VGA Connector:Pin header for VGA CRT connector
LCD Panel Connector:LVDS interface (Hirose DF13) connector
I/O
MIO:1×FDD,2×RS-232,1xRS-422,1xRS-485,1×IrDA ,1xKB+MS,1x并口
USB:1×USB
PCMCIA:Cardbus connector
Digital I/O:Pin Header , Supports 4-In and 4-Out
LAN:RJ45 connector for LAN1,Pin header (4 port)
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订货信息
ETB-300 - 3.5" backplane for ETX CPU Module w/ 1 x Intel® 82599 Fast Ethernet Controller, TI1410 CardBus, w/o cable kit(IB15)
IB15 cable kit - 2 x IDE, 2 x USB, COM, Printer, FDD, LAN, Audio, PS2, Power cable for IP300
