CPU     Supports Intel® Socket P, Core™ 2 Duo Family Processors     Supports 800 FSB CPU

内存     2 x DIMM, Dual channel DDR2 533/667 MHz up to 4 GB

芯片组     Chipset    Intel® GME965     ICH8M I/O Controller Hub

BIOS     Award System BIOS     Plug & Play support     4M bits flash ROM

网络    Intel 82573L LAN Chip     5 x PCI Express x 1 Lanes down to the carried board     Supports PXE LAN boot ROM for Ethernet Boot up     Supports Wake on LAN

显示     Intel® GME965 integrated graphics solution w/ Intel® Extreme Graphics 2 technology     Up to 64 MB of dynamic video memory allocation     One PCI Express x 16 Lane down to the carried board     Drive a standard progressive scan analog monitor with resolution up to 2048 x 1536 @ 60Hz     Supports LFP (local flat panel) LVDS interface resolution up to 1366 x 768     Single- or dual-pixel LVDS panel support up to UXGA panel resolution (1600 x 1200)     Supports Single channel for 24 bit/Dual channel for 24 bit     Supports UXDA 1600 x 1200 @ 75HZ (4:3)     Supports WUXDA 1920 x 1200 (Wide Screen)     Supports S-Video up to 1024 x 768 NTSC/PAL and 1080p HDTV

Audio    HD Audio Interface

COM Express Connectors    AB 3 x SATA / LVDS / 8 x USB 2.0 / 5 x PCIe x1 / GPIO / VGA / HDTV / HD Audio / RTC / BIOS Disable     CD IDE / PCI / SDVO / PCIex16

板载RTC     On chip RTC with battery back up     1 x external Li-ion Battery     RTC Torrance less than 2sec (24 hours) under 25˚C environment

系统监控     Derived from Super IO to support system monitor     Monitoring of 4 voltages, 2 temperatures and 1 fan Speed     4 voltage (For +3.3 V, +5 V, +12 V, Vcore)     2 Temperatures (CPU and one external Temperature Sensor)

电源需求   Follow the COM Express Specification

尺寸    COM Express Extended Module Type 2,155 mm (L) x 110 mm (W) (6.1 x 4.3)

环境     操作温度: 0°C to 60°C     存储温度: -20°C to 85°C     相对湿度: 5%~95%( 无凝露)

认证     CE approval     FCC Class A